1GHz power passing splitter. High-performance printed board circuitry provides improved hum modulation and intermodulation parameters to ensure superior signal quality (DSU-P series). Yellow-chromate plated zinc-alloy die-cast housing ensures excellent ground bonding and long corrosion-free service life in indoor/outdoor applications. Epoxy-sealed back cover provides effective EMI-RFI shielding >-80dB! eliminating signal ingress to provide distortion-free pictures. High retention seizing pins provide improved connectivity to connector center lead.